SMT Reflow Oven - easyFlow S2 Serie 845

Part No.: easyflow-S2-Series-845

Category: Reflow Soldering Systems

easyflow 845-S2 Reflow Oven

Highlights of the easyflow 845-S2:

8 top / 8 bottom heating zones – accurate full convection
Process zone length: 3755 mm – ideal for high throughput lines
Integrated flux recovery system and UPS protection
CE-certified components, electric hood lift, touchscreen control

Heatingzones:

Description & Technical data

easyflow 845-S2 Reflow Oven

The easyflow 845-S2 is the ideal reflow system for high-volume SMT production environments. With 8 top and 8 bottom heating zones and a total process length of 3755 mm, this model provides maximum throughput and stable reflow performance across a wide range of board designs.

Key Features:

Full hot air convection with 16 heating zones (8 top / 8 bottom)
Integrated flux recovery system for clean and reliable operation
CE-compliant components & electric hood lift
UPS backup for secure operation in case of power failure
User-friendly touchscreen interface with Windows OS
Optional: automatic single rail width adjustment (not compatible with center support)

Technical Specifications:

Heating Zones	8 top / 8 bottom
Total Process Length	3755 mm (heating + cooling)
Maximum Temperature	300°C
Max. PCB Width	450 mm (optional 680 mm)
Transport Speed	400–2000 mm/min
Transport Height	900 ± 15 mm
PCB Flow Direction	Left to Right (optional R→L)
Machine Dimensions	5300 × 1420 × 1520 mm
Power Supply	AC 380V / 50Hz / 3PH
Operating Power	9 KW

Service. Support. Solutions.

SMT Reflow Oven - easyFlow S2 Serie 845

easyflow 845-S2 Reflow Oven

easyflow 845-S2 Reflow Oven