The concept of the vapor phase allows today
• Reducing fluid consumption (medium) using a unique vapor recovery system; this greatly reduces production costs
• Quick return on investment and high capacity for mixed productions
• Optimum soldering quality in inert atmosphere
• Compensation for pressure fluctuations in the tank
• Minimum temperature delta throughout the working area - not achievable with other technologies
• Reduced energy consumption
• Sub-assembly repair: desoldering and resoldering
• High reliability for all types of soldering
• Precision and repeatability
• Possibility of brazing large format 500 x 500 x 60 mm cards in a small footprint
TECHNICAL CHARACTERISTICS
Max PCB dimensions 500 x 500 x 60 mm
Max. Load capacity 2 Kg
Medium capacity 5 Kg
Dimensions (L x l x H) 830 x 775 x 1140 mm
Installed power 7.5 KW / H
Power supply 3 x 400 V + N / 50 Hz
